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? 2015-2016 microchip technology inc. ds20005474c-page 1 mcp1501 features ? maximum temperature coefficient: 50 ppm/c from -40c to +125c ? initial accuracy: 0.1% ? operating temperature range: -40 to +125c ? low typical operating current: 140 a ? line regulation: 50 ppm/v maximum ? load regulation: 40 ppm/ma maximum ? 8 voltage variants available: - 1.024v - 1.250v - 1.800v - 2.048v - 2.500v - 3.000v - 3.300v - 4.096v ? output noise (10 hz to 10 khz): < 0.1 v p-p applications ? precision data acquisition systems ? high-resolution data converters ? medical equipment applications ? industrial controls ? battery-powered devices introduction the mcp1501 is a buffered voltage reference capable of sinking and sourcing 20 ma of current. the voltage reference is a low-drift bandgap-based reference. the bandgap uses chopper-based amplifiers, effectively reducing the drift to zero. the mcp1501 is available in the following packages: ? 6-lead sot-23 ? 8-lead soic ? 8-lead 2mmx2mm wdfn package types 4 1 2 3 6 v dd shdn out gnd gnd 5 gnd mcp1501 6-lead sot-23 feedback gnd v dd nc shdn out mcp1501 8-lead soic gnd gnd mcp1501 2x2 wdfn* shdn gnd gnd out gnd 1 2 3 4 8 7 6 5 gnd feedback v dd ep 9 *includes exposed thermal pad (ep). see ta b l e 3 - 1 8 7 6 5 1 2 3 4 high-precision buffered voltage reference
mcp1501 ds20005474c-page 2 ? 2015-2016 microchip technology inc. block diagram shutdown circuitry out feedback shdn gnd v dd
? 2015-2016 microchip technology inc. ds20005474c-page 3 mcp1501 1.0 electrical characteristics absolute maximum ratings (?) v dd ............................................................................................................................... ..............................................5.5v maximum current into v dd pin ........................................................................................................................... .... 30 ma clamp current, i k (v pin < 0 or v pin > v dd )........................................................................................................... 20 ma maximum output current sunk by output pin ............... ....................................................................... ................30 ma maximum output current sourced by output pin ................................................................................... ..............30 ma (hbm:cdm:mm)................................................................................................................... ............. (2 kv:1.5 kv:200v) ? notice : stresses above those listed under ?absolute ma ximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of th is specification is not implied. exposure above maximum rating conditions for extended periods may affect device reliability. table 1-1: dc characteristics electrical characteristics: unless otherwise specified, v dd(min) ?? v dd ? 5.5v at -40 ? c ? t a ? +125 ? c. characteristic sym. min. typ. max. units conditions supply voltage v dd 1.65 ? 5.5 v mcp1501-10 v dd 1.7 ? 5.5 v mcp1501-12 v dd 2.0 ? 5.5 v mcp1501-18 v dd 2.25 ? 5.5 v mcp1501-20 v dd 2.70 ? 5.5 v mcp1501-25 v dd 3.2 ? 5.5 v mcp1501-30 v dd 3.5 ? 5.5 v mcp1501-33 v dd 4.3 ? 5.5 v mcp1501-40 power-on-reset release voltage v por ?1.45 ? v power-on-reset rearm voltage ??0.8?v output voltage mcp1501-10 v out 1.0232 1.024 1.0248 v mcp1501-12 1.2490 1.250 1.2510 v mcp1501-18 1.7985 1.800 1.8015 v mcp1501-20 2.0460 2.048 2.0500 v mcp1501-25 2.4980 2.500 2.5020 v mcp1501-30 2.9975 3.000 3.0025 v mcp1501-33 3.2975 3.300 3.3025 v mcp1501-40 4.0925 4.096 4.0995 v temperature coefficient mcp1501-xx t c ? 10 50 ppm/ ? c line regulation ? v out / ? v in ? ? 50 ppm/v load regulation ? v out / ? i out ? ? 40 ppm ? sink 70 ppm ? source ppm/ma -5 ma < i load <+5ma dropout voltage v do ? ? 200 mv -5 ma < i load <+2ma power supply rejection ratio psrr 94 db 1.024v option, v in =5.5v, 1khz at 100mv p-p
mcp1501 ds20005474c-page 4 ? 2015-2016 microchip technology inc. shutdown v il 1.35 v in =5.5v v ih 3.80 output voltage hysteresis ? v out_hyst 300 v refer to section 1.1.10 ?output voltage hysteresis? for additional details on testing conditions. output noise mcp1501-10 e n ?0.1 ? v p-p 0.1 hz to 10 hz, t a =+25 ? c ? 5 ? 10 hz to 10 khz, t a =+25 ? c mcp1501-20 e n ?0.1 ? v p-p 0.1 hz to 10 hz, t a =+25 ? c ? 10 ? 10 hz to 10 khz, t a =+25 ? c mcp1501-40 e n ?0.1 ? v p-p 0.1 hz to 10 hz, t a =+25 ? c ? 20 ? 10 hz to 10 khz, t a =+25 ? c maximum load current i load ?20 ? mat a =+25c 2.048v option supply current i dd ? 140 550 a no load ? ? 350 no load, t a = +25c shutdown current mcp1501-10 i shdn 205 na t a =+25c mcp1501-20 185 mcp1501-40 185 table 1-1: dc characteristics (continued) electrical characteristics: unless otherwise specified, v dd(min) ?? v dd ? 5.5v at -40 ? c ? t a ? +125 ? c. characteristic sym. min. typ. max. units conditions table 1-2: temperature specifications electrical specifications: unless otherwise indicated, all parameters apply at av dd, dv dd = 2.7 to 3.6v. parameters sym. min. typ. max. units conditions temperature ranges operating temperature range t a -40 ? +125 c storage temperature range t a -65 ? +150 c thermal package resistance thermal resistance for sot-23-6 ? ja ? +190.5 ? c/w thermal resistance for soic-8 ? ja ? +149.5 ? c/w thermal resistance for dfn-8 ? ja ? +141.3 ? c/w
? 2015-2016 microchip technology inc. ds20005474c-page 5 mcp1501 1.1 terminology 1.1.1 output voltage output voltage is the reference voltage that is available on the out pin. 1.1.2 input voltage the input voltage (v in ) is the range of voltage that can be applied to the v dd pin and still have the device produce the designated outp ut voltage on the out pin. 1.1.3 temperature coefficient (tc out ) the output temperature coeffi cient or voltage drift is a measure of how much the output voltage will vary from its initial value with changes in ambient temperature. the value specified in the el ectrical specifications is measured as shown in equation 1-1 . equation 1-1: tc output calculation 1.1.4 dropout voltage the dropout voltage is defined as the voltage difference between v dd and v out under load. equation 1-2 is used to calculate the dropout voltage. equation 1-2: 1.1.5 line regulation an ideal voltage reference will maintain a constant out- put voltage regardless of any changes to the input volt- age. however, when real devices are considered, a small error may be measured on the output when an input voltage change occurs. line regulation is defined as the change in output volt- age ( ? v out ) as a function of a change in input voltage ( ? v in ), and expressed as a percentage, as shown in equation 1-3 . equation 1-3: line regulation may also be expressed as %/v or in ppm/v, as shown in equation 1-4 and equation 1-5 , respectively. equation 1-4: equation 1-5: as an example, if the mcp 1501-20 is implemented in a design and a 2 v change in output voltage is mea- sured from a 250 mv change on the input, then the error in percent, ppm, percent/volt, and ppm/volt, as shown in equation 1-6 ? equation 1-9 . equation 1-6: equation 1-7: equation 1-8: equation 1-9: tc out out max out min ? ? t out nom ? -------------------------------------------------------- 10 6 ppm/ ? c ? = where: out max = maximum output voltage over the temperature range out min = minimum output voltage over the temperature range out nom = average output voltage over the temperature range ? t = temperature range over which the data was collected v do v in v out | i out cons t tan = ? = ? v out ? v in -------------------- 100% ? % line regulation = ? v out ? v out nom ?? --------------------------------------- ?? ?? ?? ? v in --------------------------------------------- 100% ? % v ---- - line regulation = ? v out ? v out nom ?? --------------------------------------- ?? ?? ?? ? v in --------------------------------------------- 10 6 ? ppm v ---------- - line regulation = ? v out ? v in -------------------- 100% ? ?? ?? ?? 2 ? v 250 mv ------------------ 100% ? ?? ?? ? .0008% = ? v out ? v in -------------------- 10 6 ? ?? ?? ?? 2 ? v 250 mv ------------------ 10 6 ? ?? ?? ? 8 ppm = ? v out ? v in -------------------- 100% ? 2 ? v 2.048v ----------------- ?? ?? 250 mv ---------------------- - ?? ?? ?? ?? ?? 100% ? 0.000390625 % v ---- - = = ? v out ? v in -------------------- 10 6 ? 2 ? v 2.048v ----------------- ?? ?? 250 mv ---------------------- - ?? ?? ?? ?? ?? 10 6 ? 3.90625 ppm v ----------- - = =
mcp1501 ds20005474c-page 6 ? 2015-2016 microchip technology inc. 1.1.6 load regulation an ideal voltage reference will maintain the specified output voltage regardless of the load's current demand. however, real devices experi ence a small error voltage that deviates from the specified output voltage when a load is present. load regulation is defined as the voltage difference when under no load (v out @ i out|0 ) and under maxi- mum load (v out @ i out|max ), and is expressed as a percentage, as shown in equation 1-10 . equation 1-10: similar to line regulation, load regulation may also be expressed as %/ma or in ppm/ma as shown in equation 1-11 and equation 1-12 , respectively. equation 1-11: equation 1-12: as an example, if the mcp 1501-20 is implemented in a design and a 10 v change in output voltage is mea- sured from a 2 ma change on the input, then the error in percent, ppm, percent/volt, ppm/volt, as shown in equation 1-13 ? equation 1-16 . equation 1-13: equation 1-14: equation 1-15: equation 1-16: v out @ i out|0 v out @ i out|max ? v out @ i out|max -------------------------------------------------------------------------------------------------------------- 100% ? % load regulation = ? v out ? v out nom ?? --------------------------------------- ?? ?? ?? ? i out --------------------------------------------- 100% ? % ma ------- - line regulation = ? v out ? v out nom ?? --------------------------------------- ?? ?? ?? ? i out --------------------------------------------- 10 6 ? ppm ma ---------- - load regulation = 2.048v 2.04799v ? 2.04799v ---------------------------------------------- - 100% . = ? 0004882% 2.048v 2.04799v ? 2.04799v ---------------------------------------------- - 10 6 2.048v 2.04799v ? 2.04799v ---------------------------------------------- - 10 6 ? ?? ?? = ? 4.882 ppm = ? v out v out nom ?? ----------------------------------- - ?? ?? ?? ? i out ----------------------------------------- - 100% ? 10 ? v 2.048v ----------------- ?? ?? 2 ma ---------------------- - ?? ?? ?? ?? ?? 100% ? 0.2441 % ma ------- - = = ? v out v out max ?? ---------------------------------- - ?? ?? ?? ? i out ---------------------------------------- - 10 6 ? 10 ? v 2.048v ----------------- ?? ?? 2 ma ---------------------- - ?? ?? ?? ?? ?? 10 6 ? 0.2441 ppm m a ---------- - = =
? 2015-2016 microchip technology inc. ds20005474c-page 7 mcp1501 1.1.7 input current the input current (operating cu rrent) is the current that sinks from v in to gnd without a load current on the output pin. this current is affected by temperature, input voltage, output volt age, and the load current. 1.1.8 power supply rejection ratio power supply rejection ratio (psrr) is a measure of the change in output voltage ( ? v out ) relative to the change in input voltage ( ? v in ) over frequency. 1.1.9 long-term drift the long-term output stability is measured by exposing the devices to an ambient temperature of +125c, as shown in figure 2-18 while configured in the circuit shown in figure 1-1 . in this test, all electrical specifica- tions of the devices are measured periodically at +25c. figure 1-1: long-term drift test circuit. 1.1.10 output vo ltage hysteresis the output voltage hysteresis is a measure of the out- put voltage error after the powered devices are cycled over the entire operating temperature range. the amount of hysteresis can be quantified by measuring the change in the +25c output voltage after tempera- ture excursions from +25c to +125c to +25c, and also from +25c to -40c to +25c. v in gnd gnd gnd gnd gnd fb v out power signal in
mcp1501 ds20005474c-page 8 ? 2015-2016 microchip technology inc. notes:
? 2015-2016 microchip technology inc. ds20005474c-page 9 mcp1501 2.0 typical operating curves note: unless otherwise specified, maximum values are: v dd(min) ?? v dd ? 5.5v at -40 ? c ? t a ? +125 ? c. figure 2-1: v out vs. temperature, no load, 4.096v option. figure 2-2: v out vs. temperature, no load, 2.048v option. figure 2-3: v out vs. temperature, no load, 1.024v option. figure 2-4: load regulation vs. temperature, i load 5ma sink. figure 2-5: load regulation vs. temperature, i load 5ma source. figure 2-6: i dd vs. temperature, all options. note: the graphs and tables provided following this note ar e a statistical summary ba sed on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data pres ented may be outside the specified operating range (e.g., outside specified power suppl y range) and therefore outs ide the warranted range. 4.092 4.093 4.094 4.095 4.096 4.097 4.098 -40 5 25 85 125 vout (v) temperature ( c) 2.046 2.0465 2.047 2.0475 2.048 2.0485 -40 5 25 85 125 vout (v) temperature ( c) 1.023 1.0232 1.0234 1.0236 1.0238 1.024 1.0242 1.0244 -40 5 25 85 125 vout (v) temperature ( c) 0 5 10 15 20 25 30 35 40 -40 25 125 load reg (ppm/ma) temperature ( c) 1.024v 1.25v 1.8v 2.048v 2.5v 3v 3.3v 4.096v 0 5 10 15 20 25 30 35 40 -40 25 125 load reg (ppm/ma) temperature ( c) 1.024v 1.25v 1.8v 2.048v 2.5v 3v 3.3v 4.096v 150 175 200 225 250 275 300 -40 5 25 85 125 i dd (a) temperature ( c) v 287 = 4.096v v 287 = 2.048v v 287 = 1.024v
mcp1501 ds20005474c-page 10 ? 2015-2016 microchip technology inc. figure 2-7: i dd vs. temperature for v out , 50 units, no load, 4.096v option. figure 2-8: i dd vs. temperature for v out , 50 units, no load, 1.024v option. figure 2-9: i dd vs. v dd , v out = 4.096v, 50 units, no load. figure 2-10: i dd vs. v dd , v out = 1.024v, 50 units, no load. figure 2-11: line regulation vs. temperature. figure 2-12: noise vs. frequency, no load, t a = +25c. 0 50 100 150 200 250 300 350 400 450 -40 5 25 85 125 i dd (a) temperature ( c) average +3 sigma -3 sigma 0 50 100 150 200 250 300 -40 5 25 85 125 i dd (a) temperature ( c) average +3 sigma -3 sigma 0 50 100 150 200 250 300 350 4.3 4.45 4.6 4.75 4.9 5.05 5.2 5.5 i dd (a) v dd (v) average +3 sigma -3 sigma 100 120 140 160 180 200 220 240 260 1.65 2 2.25 2.5 2.75 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 i dd (a) v dd (v) average -3 sigma +3 sigma 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 -40 -25 -10 5 20 35 50 65 80 95 110 125 line reg (ppm/v) temperature ( c) v 287 = 1.8v v 287 = 3.0v v 287 = 1.024v v 287 = 2.048v v 287 = 3.3v v 287 = 1.25v v 287 = 2.5v v 287 = 4.096v 0.1 1 10 100 1000 10000 0.01 1 100 10000 1000000 noise nv/sqrt hz frequency v 287 = 1.024v, v '' = 1.65v v 287 = 1.024v, v '' = 5.5v v 287 = 4.096v, v '' = 4.3v v 287 = 4.096v, v '' = 5.5v
? 2015-2016 microchip technology inc. ds20005474c-page 11 mcp1501 figure 2-13: psrr vs. frequency, no load, t a = +25c. figure 2-14: psrr vs. frequency, 1 k ? load, t a = +25c. figure 2-15: dropout voltage vs. load, t a = +25c, 2.048v option. figure 2-16: tempco distribution, no load, t a = +25c, v dd = 2.7v, 50 units. figure 2-17: tempco distribution, no load, t a = +25c, v dd = 5.5v, 50 units. figure 2-18: v out drift vs. time, t a = +25c, no load, 800 units. 0 20 40 60 80 100 120 1 10 100 1000 10000 100000 psrr (db) frequency (hz) v 287 = 1.024, v ,1 = 1.65v v 287 = 1.024v, v ,1 = 5.5v v 287 = 4.096v, v ,1 = 4.3v v 287 = 4.096v, v ,1 = 5.5v 0 20 40 60 80 100 120 1 10 100 1000 10000 100000 psrr (db) frequency (hz) v 287 = 1.024v, v ,1 = 1.65v v 287 = 1.024v, v ,1 = 5.5v v 287 = 4.096v, v ,1 = 4.3v v 287 = 4.096v, v ,1 = 5.5v 0 20 40 60 80 100 120 140 160 -5 -2 0 2 5 dropout voltage (mv) load (ma) 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 1 3 5 7 9 111315171921232527 29 percentage of total units temperature coefficient (ppm/ & ) 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 13579111315171921232527 29 percentage of total units temperature coefficient (ppm/ & ) -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1 1.2 0 48 1008 vout drift (mv) time (hrs) average +3 sigma -3 sigma
mcp1501 ds20005474c-page 12 ? 2015-2016 microchip technology inc. figure 2-19: v out vs. load, t a = +25c, 2.048v option. figure 2-20: v out at v ddmin , v dd = 2.7v, 800 units, 2.5v option, no load. figure 2-21: v out distribution at v ddmax , v dd = 5.5v, 800 units, 2.5v option, no load. figure 2-22: noise vs. time, vdd = 5.5v, t a = +25c, 2.048v option, no load, 2 v/div, 100 ms/div. figure 2-23: turn on transient, v dd = 5/5v, v in = 2.048v option, no load. figure 2-24: line transient, v dd = 5.5v, v in = 500 mv pp @ 5v dc , 2.048v option, no load. 2.0475 2.0476 2.0477 2.0478 2.0479 2.048 2.0481 2.0482 2.0483 2.0484 2.0485 -30 -20 -10 0 10 20 30 v out (v) load (ma) 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 2.495111 2.4956108 2.4961106 2.4966104 2.4971102 2.49761 2.4981098 2.4986096 2.4991094 2.4996092 2.500109 2.5006088 2.5011086 2.5016084 2.5021082 2.502608 2.5031078 2.5036076 2.5041074 2.5046072 2.505107 2.5056068 2.5061066 2.5066064 2.5071062 2.507606 2.5081058 2.5086056 2.5091054 2.5096052 2.510105 percentage of total units v out qc +25c qc -40c qc +125c 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 2.495111 2.4956108 2.4961106 2.4966104 2.4971102 2.49761 2.4981098 2.4986096 2.4991094 2.4996092 2.500109 2.5006088 2.5011086 2.5016084 2.5021082 2.502608 2.5031078 2.5036076 2.5041074 2.5046072 2.505107 2.5056068 2.5061066 2.5066064 2.5071062 2.507606 2.5081058 2.5086056 2.5091054 2.5096052 2.510105 percentage of total units v out qc +25c qc -40c qc +125c conditions: v out 2v/div 500 s/div v in 2v/div 500 s/div conditions: v in 1v/div 5 ms/div v out 10 mv 5 ms/div /div
? 2015-2016 microchip technology inc. ds20005474c-page 13 mcp1501 figure 2-25: load transient, v dd = 5.5, v in = 2.5, 2.048v option. figure 2-26: r iso vs. c load , 4.096v option unloaded. figure 2-27: r iso vs. c load , 4.096v option loaded. i out 10 ma/div v out 500 mv/div 200 s/div 1.e-12 10.e-12 100.e-12 1.e-9 10.e-9 100.e-9 1.e-6 10.e-6 100.e-6 1.e-3 04590 135 capacitive load (f) phase margin ( ) r ,62 = 1 r ,62 = 10 r ,62 = 100 r ,62 = 1k 1.e-12 10.e-12 100.e-12 1.e-9 10.e-9 100.e-9 1.e-6 10.e-6 100.e-6 1.e-3 0 45 90 135 capacitive load (f) phase margin ( ) r iso = 1 ? r iso = 10 ? r iso = 100 ? r iso = 1k ?
mcp1501 ds20005474c-page 14 ? 2015-2016 microchip technology inc. notes:
? 2015-2016 microchip technology inc. ds20005474c-page 15 mcp1501 3.0 pin function table the pin functions are described in ta b l e 3 - 1 . 3.1 buffered v ref output (out) this is the buffered refe rence output. on the wdfn and soic package, this should be connected to the feedback pin at the device. the output driver is tristated when in shutdown. 3.2 buffered v ref feedback (feedback) this is the buffer amplifier feedback pin. on the wdfn and soic package, this should be connected to the out pin at the device. this connection is internal on the sot-23 package. note t hat if there is routing impedance or ir-drop between the out and feedback pins, it is the feedback pin which accu- rately holds the output voltage. this can be used in an application to remove ir-drop effects on output voltage caused by the printed circuit board (pcb) or interconnect resistance with a high-current load. 3.3 system ground (gnd) this is the power supply return and should be connected to system ground. 3.4 shutdown pin (shdn ) this is a digital input that will place the device in shutdown. this pin is active low. 3.5 power supply input (v dd ) this power pin also serves as the input voltage for the voltage reference. refer to the electrical tables to determine minimum voltage, based on the device. 3.6 exposed thermal pad (ep) not internally connected, but recommend grounding. table 3-1: pin function table sot-23 soic 2 x 2 wdfn symbol function 18 8 outbuffered v ref output ? 7 7 feedback buffered v ref feedback 2,3,5 2,4,5,6 2,4,5,6 gnd system ground 4 3 3 shdn shutdown pin active low 61 1 v dd power supply input ? ? 9 ep exposed thermal pad
mcp1501 ds20005474c-page 16 ? 2015-2016 microchip technology inc. notes:
? 2015-2016 microchip technology inc. ds20005474c-page 17 mcp1501 4.0 theory of operation the mcp1501 is a buffered voltage reference that is capable of operating over a wide input supply range while providing a stable output across the input supply range. the fundamental building block (see block dia- gram ) of the mcp1501 is an internal bandgap refer- ence circuit. as with all bandgap circuits, the internal reference sums together two voltages having an oppo- site temperature coefficient which allows a voltage ref- erence that is practically independent from temperature. the bandgap of the mcp1501 is based on a second order temperature coefficient (tc) compensated band- gap circuit that allows the mcp1501 to achieve high ini- tial accuracy and low temperature coefficient operation across supply and ambient temperature. the bandgap curvature compensation is determined during device characterization and is trimmed for optimal accuracy. the mcp1501 also includes a chopper-based amplifier architecture that ensures excellent low-noise opera- tion, further reduces temperature dependent offsets that would otherwise increas e the temperature coeffi- cient of the mcp1501, and significantly improves long-term drift performance. additional circuitry is included to eliminate the chopping frequency from the output of the device. after the bandgap voltage is compensated, it is ampli- fied, buffered, and provided to the output drive circuit which has excellent performance when sinking or sourcing load currents (5 ma).
mcp1501 ds20005474c-page 18 ? 2015-2016 microchip technology inc. notes:
? 2015-2016 microchip technology inc. ds20005474c-page 19 mcp1501 5.0 application circuits 5.1 application tips 5.1.1 basic application circuit figure 5-1 illustrates a basic circ uit configuration of the mcp1501. figure 5-1: basic circuit configuration. an output capacitor is not required for stability of the voltage reference, but may be optionally added to pro- vide noise filtering or act as a charge-reservoir for switching loads, e.g., su ccessive approximation regis- ter (sar) analog-to-digital converter (adc). as shown, the input voltage is connected to the device at the v in input, with an optional 2.2 f ceramic capacitor. this capacitor would be required if the input voltage has excessive noise. a 2.2 f capacitor would reject input voltage noise at approximately 1 to 2 mhz. noise below this frequency will be amply rejected by the input voltage rejection of the voltage reference. noise at fre- quencies above 2 mhz will be beyond the bandwidth of the voltage reference and, consequently, not transmit- ted from the input pin through the device to the output. if the noise at the output of these voltage references is too high for the particular applic ation, it can be easily fil- tered with an external rc filter and op-amp buffer (see figure 5-2 ). figure 5-2: output noise-reducing filter. v dd shdn gnd 1 2 3 4 5 8 7 6 soic-8/dfn-8 gnd )(('%$&. out gnd gnd 0.1 C 2.2 f 1.65 C 5.5v 1k out r fil c fil output of v ref
mcp1501 ds20005474c-page 20 ? 2015-2016 microchip technology inc. the rc filter values are selected for a desired cutoff frequency, as shown in equation 5-1 . equation 5-1: the values that are shown in figure 5-2 (10 k ? ? and 1 f) will create a first-order, low-pass filter at the out- put of the amplifier. the cuto ff frequency of this filter is 15.9 hz, and the attenuation slope is 20 db/decade. the mcp6021 amplifier isolates the loading of this low- pass filter from the remainder of the application circuit. this amplifier also provides additional drive, with a faster response time than the voltage reference. 5.1.2 load capacitor the output capacitor from out to gnd acts as a low-pass noise filter for the references and should not be omitted. the maximum capacitive load is 300 pf, however, larger capacitors may be implemented if a resistor is used in series with a larger load capacitor. figure 5-1 illustrates a 1 k ? resistor in series with a 2.2 f capacitor. 5.1.3 printed circuit board layout considerations mechanical stress due to pr inted circuit board (pcb) mounting can cause t he output voltage to shift from its initial value. devices in the sot-23-6 package are gen- erally more prone to assembly stress than devices in the wdfn package. to reduce stress-related output voltage shifts, mount the reference on low-stress areas of the pcb (i.e., away fr om pcb edges, screw holes and large components). f c 1 2 ? r fil c fil ?? --------------------------------------- =
? 2015-2016 microchip technology inc. ds20005474c-page 21 mcp1501 5.2 typical applications circuits 5.2.1 negative voltage reference a negative voltage referenc e can be generated using any of the devices in the mcp1501 family. a typical application is shown in figure 5-3 . in this circuit, the voltage inversion is implemented using the mcp6061 and two equal resistors. the voltage at the output of the mcp1501 voltage reference drives r1, which is con- nected to the inverting input of the mcp6061 amplifier. since the non-inverting input of the amplifier is biased to ground, the inverting input will also be close to ground potential. the second 10 k ? ? resistor is placed around the feedback loop of the amplifier. since the inverting input of the amplifier is high-impedance, the current generated through r1 will also flow through r2. as a consequence, the output voltage of the amplifier is equal to -2.5v for the mcp1501-25 and -4.096v for the mcp1501-40. figure 5-3: negative voltage reference. 5.2.2 a/d converter reference the mcp1501 product family was carefully designed to provide a precision, low noise voltage reference for the microchip families of adcs. the circuit shown in figure 5-4 shows a mcp1501-25 configured to provide the reference to the mcp3201, a 12-bit adc. figure 5-4: adc example circuit. v dd shdn gnd 1 2 3 4 5 8 7 6 gnd )(('%$&. out gnd gnd 2.2 f 2.7 C 5.5v 1k - + 10 k 0.1% 10 k 0.1% -5v -2.500v mcp1501-25 mcp6061 2.2 f v dd shdn gnd 1 2 3 4 5 8 7 6 gnd )(('%$&. out gnd gnd 2.2 f 5.0v 2.2 f mcp1501-25 mcp3201 5.0v 10 f v ref v in 0.1 f in+ in- 1
mcp1501 ds20005474c-page 22 ? 2015-2016 microchip technology inc. 6.0 package information 6.1 package markings xxnn 6-lead sot-23 example 8-lead soic example nnn 150110 sn^^^1550 256 3 e legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec ? designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part nu mber cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e xxxxy wwnnn aabty 50256 8-lead wdfn (2 x2 mm) example aaq 256 device code mcp1501t-10e/rw aaq mcp1501t-12e/rw aar mcp1501-18e/rw aas mcp1501-20e/rw aat mcp1501t-25e/rw aau mcp1501t-30e/rw aav mcp1501t-33e/rw aaw mcp1501t-40e/rw aax device code mcp1501t-10e/chy aabty mcp1501t-12e/chy aabuy mcp1501t-18e/chy aabvy mcp1501t-20e/chy aabwy mcp1501t-25e/chy aabxy mcp1501t-30e/chy aabyy mcp1501t-33e/chy aabzy mcp1501t-40e/chy aacay device code mcp1501t-10e/sn 150110 mcp1501t-12e/sn 150112 mcp1501-18e/sn 150118 mcp1501-20e/sn 150120 mcp1501t-25e/sn 150125 mcp1501t-30e/sn 150130 mcp1501t-33e/sn 150133 mcp1501t-40e/sn 150140
? 2015-2016 microchip technology inc. ds20005474c-page 23 mcp1501 6-lead plastic small outline transistor (chy) [sot-23] notes: 1. dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.127 mm per side. 2. dimensioning and tolerancing per asme y14.5m. bsc: basic dimension. theoretically exact value shown without tolerances. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging units millimeters dimension limits min nom max number of pins n 6 pitch e 0.95 bsc outside lead pitch e1 1.90 bsc overall height a 0.90 C 1.45 molded package thickness a2 0.89 C 1.30 standoff a1 0.00 C 0.15 overall width e 2.20 C 3.20 molded package width e1 1.30 C 1.80 overall length d 2.70 C 3.10 foot length l 0.10 C 0.60 footprint l1 0.35 C 0.80 foot angle i 0 C 30 lead thickness c 0.08 C 0.26 lead width b 0.20 C 0.51 b e 4 n e1 pin1idby laser mark d 1 2 3 e e1 a a1 a2 c l l1 microchip technology drawing c04-028b
mcp1501 ds20005474c-page 24 ? 2015-2016 microchip technology inc. 6-lead plastic small outline transistor (chy) [sot-23] note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 2015-2016 microchip technology inc. ds20005474c-page 25 mcp1501 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
mcp1501 ds20005474c-page 26 ? 2015-2016 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 2015-2016 microchip technology inc. ds20005474c-page 27 mcp1501
mcp1501 ds20005474c-page 28 ? 2015-2016 microchip technology inc. b a 0.05 c 0.05 c 0.10 c a b 0.05 c (datum a) (datum b) c seating plane note 1 12 n 2x top view side view bottom view for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging note: note 1 0.05 c a b 0.05 c microchip technology drawing c04-261a sheet 1 of 2 8-lead very, very thin plastic dual flat, no lead package (rw) - 2x2 mm body [wdfn] 2x e d 12 n e2 d2 2x ch (k) 8x b e l a (a3) 0.05 c a1
? 2015-2016 microchip technology inc. ds20005474c-page 29 mcp1501 microchip technology drawing c04-261a sheet 2 of 2 for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging note: number of terminals overall height terminal width overall width overall length terminal length exposed pad width exposed pad length terminal thickness pitch standoff units dimension limits a1 a b d e2 d2 (a3) e l e n 0.50 bsc 0.10 ref 0.70 1.10 0.25 0.20 0.70 0.00 0.25 2.00 bsc 0.30 1.20 0.80 0.75 0.02 2.00 bsc millimeters min nom 8 0.90 1.30 0.35 0.30 0.80 0.05 max (k) - 0.30 - ref: reference dimension, usually without tolerance, for information purposes only. bsc: basic dimension. theoretically exact value shown without tolerances. 1. 2. 3. notes: pin 1 visual index feature may vary, but must be located within the hatched area. package is saw singulated dimensioning and tolerancing per asme y14.5m terminal-to-exposed-pad 8-lead very, very thin plastic dual flat, no lead package (rw) - 2x2 mm body [wdfn] exposed pad chamfer ch - 0.25 -
mcp1501 ds20005474c-page 30 ? 2015-2016 microchip technology inc. recommended land pattern for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging note: dimension limits units ch optional center pad width center pad chamfer optional center pad length contact pitch x2 y2 1.30 0.90 millimeters 0.50 bsc min e max 0.28 contact pad length (x8) contact pad width (x8) y1 x1 0.70 0.30 bsc: basic dimension. theoretically exact value shown without tolerances. notes: 1. dimensioning and tolerancing per asme y14.5m microchip technology drawing c04-2261a nom 8-lead very, very thin plastic dual flat, no lead package (rw) - 2x2 mm body [wdfn] c contact pad spacing 2.10 contact pad to contact pad (x6) g1 0.20 c e g x1 y1 y2 x2 2x ch (g2) silk screen 1 2 8 contact pad to center pad (x8) g1 0.25 ref ref: reference dimension, usually without tolerances, for reference only. thermal via diameter v 0.30 ?v
? 2015-2016 microchip technology inc. ds20005474c-page 31 mcp1501 appendix a: revision history revision c (may 2016) the following is the list of modifications: 1. updated section 1.0, electrical characteristics , section 4.0, theory of operation , section 5.0, application circuits . 2. updated features section, introduction section, section 3.1, buffered v ref output (out) . 3. updated ?product identi fication system? section. 4. updated figure 2-12 , figure 2-20 , figure 2-21 , figure 5-1 and figure 5-4 . 5. updated equation 1-10 and equation 1-16 . 6. various typographical edits. revision b (january 2016) the following is the list of modifications: 1. updated section 6.0, package information . 2. updated ?product identification system? section. 3. minor typographical errors. revision a (december 2015) original release of this document.
mcp1501 ds20005474c-page 32 ? 2015-2016 microchip technology inc. notes:
? 2015-2016 microchip technology inc. ds20005474c-page 33 mcp1501 product identification system to order or obtain information, e.g., on pricing or de livery, refer to the factory or the listed sales office . part no.- x /xx package output voltage option device device: mcp1501 ? 50 ppm typical thermal drift buffered reference tape and reel option: blank = standard packaging (tube or tray) t = tape and reel (1) output voltage option: 10 = 1.024v 12 = 1.200v 18 = 1.800v 20 = 2.048v 25 = 2.500v 30 = 3.000v 33 = 3.300v 40 = 4.096v package: chy* = 6-lead plastic small outline transistor (sot-23) sn = 8-lead plastic small outline ? narrow, 3.90 mm body (soic) rw = 8-lead very, very thin plastic dual flat, no lead package ? 2 x 2 mm body (wdfn) *y = nickel palladium gold manufacturing designator. only available on the sot-23 package. examples: a) mcp1501t-10e/chy: 1.024v, 6-lead sot-23 package, tape and reel b) mcp1501-12e/sn: 1.2v, 8-lead soic package c) mcp1501t-18e/sn: 1.8v, 8-lead soic package, tape and reel d) mcp1501t-20e/rw: 2.048v, 8-lead wdfn package, tape and reel note 1: tape and reel identifier only appears in the catalog part number description. this identifier is used for ordering pur- poses and is not printed on the device package. check with your microchip sales office for package availability for the tape and reel option. [x] (1) tape and reel
mcp1501 ds20005474c-page 34 ? 2015-2016 microchip technology inc. notes:
? 2016 microchip technology inc. ds20005474c-page 35 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application me ets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safe ty applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting fr om such use. no licenses are conveyed, implicitly or ot herwise, under any microchip intellectual property rights unless otherwise stated. trademarks the microchip name and logo, the microchip logo, anyrate, dspic, flashflex, flexpwr, heldo, jukeblox, keeloq, keeloq logo, kleer, lancheck, link md, medialb, most, most logo, mplab, optolyzer, pic, picstart, pic32 logo, righttouch, spynic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. clockworks, the embedded control solutions company, ethersynch, hyper speed control, hyperlight load, intellimos, mtouch, precision edge, and quiet-wire are registered trademarks of microc hip technology incorporated in the u.s.a. analog-for-the-digital age, any capacitor, anyin, anyout, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dynamic average matching, dam, ecan, ethergreen, in-circuit serial programming, icsp, inter-chip connectivity, jitterblocker, kleernet, kleernet logo, miwi, motorbench, mpasm, mpf, mplab certified logo, mplib, mplink, multitrak, netdetach, omniscient code generation, picdem, picdem.net, pickit, pictail, puresilicon, righttouch logo, real ice, ripple blocker, serial quad i/o, sqi, superswitcher, superswitcher ii, total endurance, tsharc, usbcheck, varisense, viewspan, wiperlock, wireless dna, and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. gestic is a registered tradem arks of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2016, microchip technology incorporated, printed in the u.s.a., all rights reserved. isbn: 978-1-5224-0559-7 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal meth ods used to breach the code protection fe ature. all of these methods, to our knowledge, require using the microchip pr oducts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwa re or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microper ipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem by dnv == iso/ts 16949 ==
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